Engineering cooling systems for AI clusters, GPU servers, HPC platforms and next-generation data centers.
ColdEngine AI provides high-density liquid cooling solutions for AI training clusters, HPC systems and next-generation data centers.
Direct-to-chip liquid cooling cabinet designed for high-density GPU deployments. Supports modern AI accelerators and high-performance computing workloads.
Integrated Cooling Distribution Units with N+1 pump architecture, heat exchangers, smart monitoring and leak detection.
Custom cold plate design for GPU, CPU and accelerator platforms. Optimized for thermal performance and pressure drop.
From thermal architecture to commissioning support, ColdEngine assists customers throughout the project lifecycle.
Engineering-first approach for liquid cooling infrastructure.
Heat transfer modelling, temperature distribution analysis and cooling optimization.
Flow balancing, pressure drop estimation and coolant loop design.
Micro-channel structure design, material selection and manufacturability review.
Pump selection, heat exchanger sizing, control logic and system integration.
High-density rack design, coolant distribution routing and site implementation.
PUE reduction, energy efficiency improvement and thermal performance enhancement.
Focused on practical engineering for the next generation of AI infrastructure.
Designed to reduce cooling overhead and improve energy utilization.
Support for 60kW+ liquid-cooled rack deployments.
Scalable designs for different customer requirements and deployment sizes.
Real-world thermal engineering, not just equipment integration.
Typical design targets for a 60kW AI liquid cooling cabinet.
60 kW
Deionized Water or Dielectric Fluid
5°C – 10°C
N+1 Pump Architecture
Temperature Flow Pressure Leak Detection
60kW → 120kW+ Scalable Architecture