Engineering next-generation liquid cooling infrastructure for high-density GPU clusters and European data centers.
Scalable liquid-cooled AI compute infrastructure.
Rack-level closed-loop thermal distribution system.
Direct-to-chip high efficiency thermal interface.
Ultra-efficient energy architecture for AI workloads.
Supports district heating and industrial reuse.
Real-time monitoring and multi-layer sealing design.
Designed for European compliance standards.
Stable operation under extreme European summer temperatures.
Prevents moisture formation in cold environments.
Dynamic flow adjustment based on load & climate.
60–100 kW
Direct Liquid Cooling
< 1.1
CE / ERP Ready
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